Pob zeb diamond kev lag luam tus nqi saw yuav tsum tau nthuav tawm ntawm FINE2026 Shanghai

Thaum Lub Rau Hli 10, 2026, 2026 Yav Tom Ntej Kev Lag Luam Cov Khoom Siv Tshiab Expo (FINE2026) tau qhib ntawm Shanghai New International Expo Center. Tsim los ntawm kev sib koom ua ke thiab kev txhim kho ntawm peb qhov kev nthuav qhia tshwj xeeb, qhov kev tshwm sim npog thaj tsam ntawm 40,000 square meters. Ua ke nrog "15th Tsib-Xyoo Plan" rau kev txhim kho kev lag luam yav tom ntej, nws tsom mus rau cov haujlwm xws li cov khoom siv hluav taws xob siab tshaj, kev tswj xyuas thermal, thiab cov roj teeb siab heev, ua lub platform rau kev lag luam- kev kawm{11}} kev sib koom tes tshawb fawb thiab txhawb kev loj hlob ntawm "cov khoom tsim tau zoo tshiab."

Ntawm qhov qhib ceremony, cov neeg sawv cev ntawm cov koom haum kev lag luam thiab cov lag luam tau hais tias cov ntaub ntawv tshiab tsim lub hauv paus tseem ceeb ntawm kev lag luam yav tom ntej; lub expo pab txhawb kev lag luam ntawm cov thev naus laus zis thiab pab kev lag luam tuav lub sijhawm ua lag luam. Lub rooj nthuav qhia muaj ob thaj chaw tseem ceeb: Advanced Semiconductor Zone (N1) thiab AI Chip Thermal Management Zone (N2), nrog pob zeb diamond-nrog rau nws cov khoom tshwj xeeb xws li ultra-siab thermal conductivity thiab dav bandgap- ua qhov tseem ceeb.

Ntau tshaj li ib puas lub tuam txhab pob zeb diamond thiab cov chaw tshawb fawb los ntawm thoob plaws lub teb chaws tau sib sau ua ke los nthuav tawm cov kev lag luam ua tiav, xws li pob zeb diamond ib leeg muaju, cov khoom siv hluav taws xob, thiab cov khoom siv hluav taws xob rau kev loj hlob thiab cov cuab yeej ua tiav. Cov khoom pov thawj no qhia txog cov khoom siv hloov pauv los ntawm cov khoom siv superhard ib txwm ua rau cov khoom siv rau cov khoom siv hluav taws xob thiab kev tswj xyuas thermal. Cov thawj coj hauv kev lag luam xws li Zhongnan Pob Zeb Diamond thiab Ningbo Jingzuan tau nthuav tawm siab - cov khoom kawg xws li semiconductor- qib pob zeb diamond wafers thiab CVD cov khoom siv hluav taws xob, thaum lub tuam txhab tswj xyuas thermal qhia cov pob zeb diamond sib xyaw ua kom sov dissipation substrates tsim los daws cov kev sib tw txias rau siab - zog AI chips. Tsis tas li ntawd, ib qho kev qhia dav dav ntawm cov khoom siv hauv tsev tsim khoom ua haujlwm- suav nrog MPCVD systems, laser txiav cov cuab yeej, thiab ultra- precision polishing tshuab- tau nthuav tawm, qhia txog kev ywj pheej R & D muaj peev xwm ntawm Tuam Tshoj lub pob zeb diamond kev lag luam saw.

 

Lub expo nthuav tawm ntau lub rooj sab laj kev tshaj lij uas hais txog cov ncauj lus xws li pob zeb diamond technology frontiers, thib peb - thiab thib plaub - tiam semiconductors, thiab nti thermal tswj, qhov twg cov kws tshaj lij kev lag luam tau tham txog cov kev taw qhia thev naus laus zis yav tom ntej. Hais txog kev sib koom ua ke ntawm kev lag luam, kev kawm, kev tshawb fawb, thiab nyiaj txiag, qhov kev tshwm sim tau tuav ntau dua 5,000 cov koom haum caw peev thiab kawg - cov neeg siv khoom. Kev ua si ib txhij-nrog rau kev tshawb fawb qhia, kev sib tw ua lag luam, thiab kev tshaj tawm cov khoom lag luam tshiab- tau teeb tsa kom nrawm rau kev lag luam thiab kev lag luam siv cov khoom siv tshiab tshiab.