Daim Ntawv Thov Pob Zeb Diamond hauv Cov Khoom Siv Hluav Taws Xob Tshiab

Niaj hnub nimno microelectronics thev naus laus zis tab tom txhim kho sai, thiab cov tshuab hluav taws xob thiab khoom siv tau tsim nyob rau hauv kev coj ua ntawm kev sib koom ua ke loj, miniaturization, kev ua haujlwm siab, thiab kev ntseeg siab. Kev nce hauv kev sib koom ua ke ntawm cov tshuab hluav taws xob yuav ua rau muaj zog ntau dua, nrog rau cov cua sov uas tsim los ntawm cov khoom siv hluav taws xob thiab kev ua haujlwm tag nrho ntawm qhov system. Yog li ntawd, kev ntim khoom zoo yuav tsum daws qhov teeb meem ntawm cov cua sov dissipation ntawm cov tshuab hluav taws xob.

Cov cuab yeej zoo thaum tshav kub kub dissipation yog nyob ntawm optimized heat dissipation qauv tsim, ntim cov khoom xaiv (cov khoom siv thermal interface thiab cov cua kub dissipation substrate), thiab ntim cov txheej txheem tsim khoom. Ntawm lawv, kev xaiv cov khoom siv substrate yog qhov txuas tseem ceeb, uas cuam tshuam ncaj qha rau tus nqi, kev ua tau zoo thiab kev ntseeg siab ntawm cov cuab yeej. Feem ntau hais lus, kev siv cov khoom ntim khoom siv hluav taws xob yuav tsum xav txog ob qho kev ua tau zoo. Thawj yog siab thermal conductivity kom ua tiav cov cua kub hloov ceev thiab xyuas kom meej tias cov nti tuaj yeem ua haujlwm ruaj khov nyob rau hauv qhov kub thiab txias; nyob rau tib lub sijhawm, cov khoom ntim khoom yuav tsum muaj kev ntseeg siab. Adjustable thermal expansion coefficient, thiaj li ua kom sib txuam nrog cov nti thiab txhua qib ntawm cov khoom ntim, thiab txo qhov tsis zoo ntawm thermal stress. Txoj kev txhim kho ntawm cov khoom ntim khoom siv hluav taws xob yog qhov kev txhim kho txuas ntxiv thiab kev ua kom zoo ntawm ob lub zog no.

 

Yog lawm, cov ntaub ntawv ntim cov substrate tshiab kuj yuav tsum xav txog lwm yam khoom, xws li kev tiv thaiv siab, tsis tshua muaj dielectric tas li, dielectric poob, zoo thermal txuam nrog silicon thiab gallium arsenide, siab nto flatness, zoo mechanical zog thiab yooj yim ntawm kev lag luam ntau lawm thiab lwm yam ntxwv. , yog li kev xaiv cov khoom ntim tshiab substrate yog qhov chaw kub rau kev tshawb fawb thiab kev loj hlob hauv ntau lub teb chaws. Tam sim no, ntau lub hnab ntim khoom siv feem ntau suav nrog Al2O3 ceramics, SiC ceramics, AlN thiab lwm yam ntaub ntawv.

 

Raws li thaum ntxov xyoo 1929, German Siemens lub tuam txhab ua tiav Al2O3 ceramics, tab sis cov thermal expansion coefficient thiab dielectric tas li ntawm Al2O3 yog siab dua cov Si ib leeg muaju, thiab cov thermal conductivity tsis siab txaus, yog li Al2O3 ceramic substrates tsis haum rau siab. zaus, Fais fab loj, siv hauv VLSI.

 

Ua raws li qhov no, cov khoom siv thermal conductivity ceramic substrate SiC, AlN, SI3N4, thiab pob zeb diamond maj mam nkag mus rau hauv kev ua lag luam.

Lub thermal conductivity ntawm SiC ceramics yog siab heev, thiab siab dua qhov purity ntawm SiC crystallization, siab dua thermal conductivity; Qhov loj tshaj qhov tsis zoo ntawm SiC yog tias qhov dielectric tas li siab dhau lawm thiab lub zog dielectric tsawg, yog li nws txwv nws cov kev siv ntau zaus thiab tsuas yog tsim rau cov ntim ntim tsawg.

 

Cov khoom siv AlN muaj cov khoom siv hluav taws xob zoo heev thiab cov khoom siv tshuaj ruaj khov, tshwj xeeb tshaj yog nws cov thermal expansion coefficient sib tw ntawm silicon, yog li nws tuaj yeem siv los ua cov khoom ntim semiconductor substrate nrog kev loj hlob zoo. Txawm li cas los xij, cov thermal conductivity yog tsawg, thiab raws li semiconductor ntim muaj ntau dua thiab siab dua cov kev xav tau rau cov cua sov dissipation, AlN cov ntaub ntawv kuj muaj qee yam kev loj hlob bottleneck.

 

Thaum kawg, pob zeb diamond sawv tawm. Pob zeb diamond muaj cov khoom siv thermophysical zoo heev. Nws thermal conductivity ntawm chav tsev kub yog {{0}}W/(m·K), thiab nws thermal expansion coefficient yog 0.8 ×10-6/K. Nws muaj peev xwm zoo hauv semiconductors, optics, thiab lwm yam. Ntau yam khoom zoo heev, tab sis ib lub pob zeb diamond tsis yooj yim los ua rau hauv cov khoom ntim, thiab tus nqi siab.

 

Raws li txoj cai sib xyaw, pob zeb diamond / hlau matrix sib xyaw npaj los ntawm kev ntxiv cov pob zeb diamond rau hauv Ag, Cu, Al thiab lwm yam thermal conductivity hlau matrix yuav tsum tau los ua ib yam tshiab ntawm cov khoom ntim hluav taws xob nrog ob qho tib si thermal expansion coefficient thiab siab thermal. conductivity. Raws li cov khoom siv hluav taws xob zoo heev thiab cov thermal conductivity ntawm tooj liab, cov khoom siv pob zeb diamond / tooj liab sib xyaw tau tsim los ua cov khoom siv hauv cov khoom siv hluav taws xob, thiab nws tau lees paub tias cov khoom siv pob zeb diamond / tooj liab sib xyaw muaj cov plating zoo thiab cov khoom siv, uas ua tau raws li Electronic. ntim cov ntaub ntawv substrate yuav tsum tsis tshua muaj thermal expansion coefficient thiab siab thermal conductivity, thiab piv nrog Mo / Cu alloys, lawv muaj qis dua thiab sib dua.

 

Yog li ntawd, pob zeb diamond / tooj liab composites nrog pob zeb diamond raws li cov theem txhawb zog thiab tooj liab raws li cov khoom siv matrix Cov ntaub ntawv tuaj yeem siv rau cov ntim ntim, uas tuaj yeem txhim kho kev ua haujlwm ntawm cov khoom siv hluav taws xob thiab pab txo qhov hnyav ntawm cov khoom siv.

Nrog kev txhim kho txuas ntxiv ntawm cov teeb meem kev lag luam hauv cov ntaub ntawv, cov khoom siv, thiab lwm yam, pob zeb diamond tau dhau los ua cov khoom siv hauv qab nrog cov thermal conductivity thiab zoo cua sov dissipation. Nws muaj kev siv dav dav hauv qhov chaw kub siab dua. Cov khoom siv semiconductor zoo tshaj plaws rau cov khoom siv hluav taws xob ceev, nws lub peev xwm loj txaus nyiam ntau thiab ntau tus kws tshawb fawb kom mob siab rau lawv tus kheej rau nws. Lub peev xwm ntawm pob zeb diamond yuav maj mam tsim kom tau raws li cov kev xav tau ntawm kev lag luam semiconductor yav tom ntej thiab nyob hauv ib qho chaw hauv cov khoom siv hluav taws xob semiconductor.