Dab tsi yog pob zeb diamond polishing slurry?

Dab tsi yog pob zeb diamond polishing slurry?
Pob zeb diamond polishing slurry(tseem hu uaPob zeb diamond Polishing kua los yog Pob Zeb Diamond Abrasive Slurry) tuaj yeem muab faib ua monocrystalline pob zeb diamond polishing slurry, polycrystalline pob zeb diamond polishing slurry, thiab nanodiamond polishing slurry. Raws li qhov nruab nrab dispersion, pob zeb diamond polishing slurry tuaj yeem muab faib ua dej -raws li, roj-raws li, thiab dav - hom hom phiaj.

 

Pob zeb diamond polishing kua yog cov khoom siv ua haujlwm siab - siv rau kev sib tsoo thiab polishing. Nws cov khoom tseem ceeb yog micron lossis nano- cov pob zeb diamond me me uas tau tawg mus rau hauv cov kua nruab nrab.

 

 

I. Cov Ntsiab Cai

Pob zeb diamond Abrasive

• Hom: Feem ntau ib leeg -polycrystalline pob zeb diamond particles, uas tsis tshua muaj siab hardness (Mohs hardness 10).
• Particle Size Range: Los ntawm kaum ntawm micrometers (coarse polishing) mus rau kaum nanometers (ultra-precision polishing), xaiv tau raws li qhov yuav tsum tau ua.

 

Dispersion nruab nrab

• Dej-raws li lossis roj- cov kua dej (xws li dej deionized, glycerin, cawv), siv los faib cov pob zeb diamond sib npaug.

 

Cov tshuaj ntxiv

• Dispersing agents: Tiv thaiv particle agglomeration thiab xyuas kom ruaj khov.
• pH adjusters, preservatives, thiab lwm yam., yoog rau cov khoom sib txawv.

 

II. Lub ntsiab nta

Ultra{0}}High Hardness

• Muaj peev xwm ua cov ntaub ntawv nyuaj thiab nkig (xws li sapphire, silicon carbide, ceramics, optical iav, thiab lwm yam).

 

High Cutting Efficiency

• Cov npoo ntse muab cov ntaub ntawv tshem tawm siab thaum txo cov subsurface puas.

 

Zoo heev Surface Quality

• Nanometer- nplai polishing kua tuaj yeem ua tiav atomic- theem roughness (Ra < 1nm), haum rau ultra- precision machining.

 

Muaj zog ruaj khov

• Uniform dispersion system tiv thaiv sedimentation los yog agglomeration, ua kom muaj kev sib xws.

III. Daim ntawv thov teb

Semiconductors thiab Optoelectronics

• Polishing ntawm silicon wafers, silicon carbide substrates, thiab sapphire qhov rais wafers.

 

Precision Optics

• Ultra- du nto ua cov lo ntsiab muag, prisms, thiab laser muaju.

 

Advanced Ceramics

• Sib tsoo ntawm cov qauv ceramics xws li zirconia thiab aluminium nitride.

 

Hlau ua

• Polishing ntawm cemented carbide thiab tungsten steel pwm.

 

Kev tshawb fawb thiab kev sim

• Kev npaj cov qauv metallographic, electron microscope kuaj, thiab lwm yam.

 

IV. Kev ceev faj rau kev siv

Dispersion Stability

• Co zoo los yog siv ultrasonic dispersion ua ntej siv los tiv thaiv particle sedimentation los ntawm kev cuam tshuam cov txiaj ntsig.

 

Khoom Compatibility

• Yuav tsum tau siv cov tshuab polishing thiab polishing pads (xws li tsis yog - ntaub npuag, polyurethane pads).

 

Txheej txheem Parameter Optimization

• Lub siab, kev sib hloov ceev, thiab tus nqi ntws yuav tsum tau hloov kho raws li cov khoom siv kom tsis txhob khawb lossis tsis txaus ua haujlwm.

 

Kev kho kua dej khib nyiab

• Cov kua dej khib nyiab uas muaj cov pob zeb diamond yuav tsum tau lim los yog siv dua tshiab kom tsis txhob muaj kuab paug ib puag ncig.

 

V. Kev sib piv nrog cov khoom zoo sib xws

 

VI. Common Market Product Specifications

Particle loj grading:

• W0.5 (~ 0.5μm), W1, W3, W5, thiab lwm yam (raws li Japanese JIS tus qauv).

 

Concentration:

• Feem ntau 1% mus rau 10% los ntawm qhov hnyav; Cov ntsiab lus siab dua yog siv rau kev ntxhib polishing, thiab qis dua rau kev polishing zoo.

 

Ntim:

• 50ml mus rau 5-liter fwj, nrog rau qee qhov kev xaiv rau cov qauv tsim.

 

VII. Txoj Kev Loj Hlob

Nanotechnology thiab Monodisperse Technology

• Ntau hom nanoparticles txhim kho qhov sib xws.

 

Composite Polishing Fluids

• Ntxiv chemical additives (xws li oxidizers) kom ua tiav "mechanical + chemical" synergistic polishing.

 

Ntsuab thiab Environmentally Friendly

• Biodegradable media thiab recycling technologies.